Encapsulation technology can greatly improve the efficiency and durability of electric motors, and is also used for electronic devices such as batteries, inverters, voltage converters, electronic control units, wire harnesses, sensors and switches. Huntsman offers epoxy and polyurethane encapsulant chemistries that provide customers with optimal solutions for their specific applications.
Our trusted ARALDITE® brand offers a wide range of heat-conductive encapsulants for all the electronic parts in the electrified powertrain. Huntsman’s encapsulants protect sensitive devices, improve thermal management, and meet the most stringent temperature resistance requirements. They offer high flexibility and crack resistance, optimized thermal conductivity, and excellent thermal endurance, as well as improved chemical stability.
Glass transition temperature (Tg):
210°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Superior flow and gap filling capabilities enabling fast processing times. High Tg enabling low thermal expansion within the complete operation range. Very high thermal and chemical endurance (Class N).
Glass transition temperature (Tg):
200°C
Thermal conductivity:
0.6 W/(m.K)
Suitable for:
Developed for rotor potting. Very low CTE, highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation, high Tg. Outstanding resistance at elevated temperatures and high rotation speed.
Glass transition temperature (Tg):
200°C
Thermal conductivity:
0.95 W/(m.K)
Suitable for:
Highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation. Developed for rotor potting with improved heat dissipation.
Glass transition temperature (Tg)
200°C
Thermal conductivity
0.2 W/(m.K)
Suitable for:
High strength and modulus supporting the rotor structure during operation within the entire operation range. Low CTE, outstanding dimensional stability at high loads. Low viscosity and long pot life for versatile processing, e.g. filament winding.
Glass transition temperature (Tg):
170°C
Thermal conductivity:
0.6 W/(m.K)
Suitable for:
Very good impregnation. Developed for rotor potting. Toughened with reinforcing fillers for superior crack and thermal shock resistance.
Glass transition temperature (Tg):
165°C
Thermal conductivity:
3.0 W/(m.K)
Suitable for:
1-c epoxy system with deep viscosity drop above 60°C for fast processing. Very high thermal conductivity and endurance. Excellent resistance to atmospheric and chemical degradation.
Glass transition temperature (Tg):
140°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Fast fill and cure times enabling fast processing. Low coefficient of thermal expansion (28·10-6 1/K). Flammability certification UL 94 V-0 (6.0 mm) and thermal endurance (Class H).
Glass transition temperature (Tg):
115°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Excellent gap filling capability and heat conductivity. Toughened resin with reinforcing fillers for superior crack and thermoshock resistance. Very high thermal and chemical endurance.
Glass transition temperature (Tg):
133°C
Thermal conductivity:
0.6 W/(m.K)
Suitable for:
REACH compliant, mineral filled resin with excellent impregnation capability and high crack resistance. Sedimentation free enabling IBC packaging.
Glass transition temperature (Tg):
100°C
Thermal conductivity:
1.2 W/(m.K)
Suitable for:
Well balanced properties: good heat conductivity, very good crack resistance, media and thermal resistance. Excellent flow properties allow for fast filling times and good impregnation.
Glass transition temperature (Tg):
85°C
Thermal conductivity:
1.0 W/(m.K)
Suitable for:
Excellent crack and thermal shock resistance with good filling factor and thermal conductivity. Superior mechanical and electrical properties. Thermal Class H, recommended for stators encapsulation.
Glass transition temperature (Tg):
75°C
Thermal conductivity:
0.9 W/(m.K)
Suitable for:
Good heat conductivity and thermal endurance (Class H). Flammability certification UL 94 V-0 (3.0 mm) and HB (1.5 mm).
Glass transition temperature (Tg):
60 - 65°C
Thermal conductivity:
0.8 - 1.1 W/(m.K)
Suitable for:
Fast processing and curing comparable to impregnation processes. Excellent flow and gap filling with adaptable viscosity and thermal conductivity. High temperature and crack resistance. Recommended for hairpin windings.
Glass transition temperature (Tg):
20°C
Thermal conductivity:
0.5 W/(m.K)
Suitable for:
Polyurethane, halogen free, casting and impregnating system for processing and curing at room temperature. Soft multipurpose polyurethane system for pressure sensitive devices. Available in various colors. Flammability certification UL 94 V-0 (6.0 mm)
Glass transition temperature (Tg):
20°C
Thermal conductivity:
1.1 W/(m.K)
Suitable for:
Increased heat conductivity. Flammability certification UL 94 V-0 (3.2 mm). Low curing temperature and Tg enabling low thermally induced stress.
Glass transition temperature (Tg):
-50°C
Thermal conductivity:
1.8 W/(m.K)
Suitable for:
Polyurethane, flame retardant and halogen free systems for processing and curing at room temperature. High flexibility and low modulus, improving battery crash-safety within the entire operation range. Good adhesion to new substrates, enabling battery cells fixation and thermal management.
Glass transition temperature (Tg):
20°C
Thermal conductivity:
0.55 W/(m.K)
Suitable for:
Discover our ARALDITE® encapsulants for electric motors, battery and power electronics.
Resin systems used for encapsulation processes must exhibit high thermal resistance and thermal conductivity, flame retardancy, excellent mechanical and dielectric properties, variable hardness and high dimensional stability.
Thermosets such as epoxies and polyurethanes are used to protect electronic devices against chemical, mechanical and electrical loads.
Extreme temperature is by far the most common stress applied to electronic devices. The ability of parts to withstand thermal shocks can be enhanced by selecting a resin with the correct coefficient of linear thermal expansion (CTE) and an optimal thermal endurance profile, in particular for high-temperature applications.
Epoxy resins are proven for long-term thermal endurance. Polyurethane systems are also available, offering thermal endurance profiles above 100° C and flexibility at low temperatures.
Chemical resistance of thermosetting resins is strongly related to the cross-linked density of the polymer network. As a rule of thumb, the harder the material, the better the chemical resistance.
Huntsman’s resin systems exhibit high thermal endurance for long-term reliability and high crack resistance, as we recently demonstrated in an extensive experimental study. All products are tested by our in-house electrical and mechanical testing laboratories to ensure they provide the desired properties and comply with environmental requirements. Our UL-certified laboratory can speed up the approval process and minimize time to market.
