Encapsulation Resin Systems

Encapsulation Resin Systems

Encapsulation technology can greatly improve the efficiency and durability of electric motors, and is also used for electronic devices such as batteries, inverters, voltage converters, electronic control units, wire harnesses, sensors and switches. Huntsman offers epoxy and polyurethane encapsulant chemistries that provide customers with optimal solutions for their specific applications.

Epoxy and Polyurethane Encapsulants

Our trusted ARALDITE® brand offers a wide range of heat-conductive encapsulants for all the electronic parts in the electrified powertrain. Huntsman’s encapsulants protect sensitive devices, improve thermal management, and meet the most stringent temperature resistance requirements. They offer high flexibility and crack resistance, optimized thermal conductivity, and excellent thermal endurance, as well as improved chemical stability.

Araldite® CW 2731

Glass transition temperature (Tg):
165°C

Thermal conductivity:
3.0 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

1-c epoxy system with deep viscosity drop above 60°C for fast processing. Very high thermal conductivity and endurance. Excellent resistance to atmospheric and chemical degradation.

Araldite® CW 30386 /
Aradur® HW 30387

Glass transition temperature (Tg):
200°C

Thermal conductivity:
0.6 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting 
  • Automatic Pressure Gelation

Developed for rotor potting. Very low CTE, highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation, high Tg. Outstanding resistance at elevated temperatures and high rotation speed.

Araldite® CW 5742 /
Aradur® HY 5726

Glass transition temperature (Tg):
210°C

Thermal conductivity:
0.7 W/(m.K) 

Suitable for: 

  • Vacuum Casting 
  • Automatic Pressure Gelation

Superior flow and gap filling capabilities enabling fast processing times. High Tg enabling low thermal expansion within the complete operation range. Very high thermal and chemical endurance (Class N).

Araldite® CW 30334 /
Aradur® HW 30335

Glass transition temperature (Tg):
100°C

Thermal conductivity:
1.2 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Well balanced properties: good heat conductivity, very good crack resistance, media and thermal resistance. Excellent flow properties allow for fast filling times and good impregnation.

Araldite® CW 30407 /
Aradur® HW 30408 /
Aradur® HW 30409

Glass transition temperature (Tg):
60 - 65°C

Thermal conductivity:
0.8 - 1.1 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Fast processing and curing comparable to impregnation processes. Excellent flow and gap filling with adaptable viscosity and thermal conductivity. High temperature and crack resistance. Recommended for hairpin windings.

Araldite® CW 30326 /
Aradur® HW 30327

Glass transition temperature (Tg):
115°C

Thermal conductivity:
0.7 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Excellent gap filling capability and heat conductivity. Toughened resin with reinforcing fillers for superior crack and thermoshock resistance. Very high thermal and chemical endurance.

Araldite® CW 1312 /
Aradur® HY 1300

Glass transition temperature (Tg):
20°C

Thermal conductivity:
1.1 W/(m.K)

Suitable for: 

  • Vacuum Casting

Increased heat conductivity. Flammability certification UL 94 V-0 (3.2 mm). Low curing temperature and Tg enabling low thermally induced stress.

Araldite® CW 1302 /
Aradur® HY 1300

Glass transition temperature (Tg):
75°C

Thermal conductivity:
0.9 W/(m.K)

Suitable for:

  • Vacuum Casting

Good heat conductivity and thermal endurance (Class H). Flammability certification UL 94 V-0 (3.0 mm) and HB (1.5 mm).

Araldite® CW 1195 /
Aradur® HW 1196

Glass transition temperature (Tg):
140°C

Thermal conductivity:
0.7 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Automatic Pressure Gelation

Fast fill and cure times enabling fast processing. Low coefficient of thermal expansion (28·10-6 1/K). Flammability certification UL 94 V-0 (6.0 mm) and thermal endurance (Class H).

Arathane® CW 5620 /
Arathane® HY 5610

Glass transition temperature (Tg):
20°C

Thermal conductivity:
0.5 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting

Polyurethane, halogen free, casting and impregnating system for processing and curing at room temperature. Soft multipurpose polyurethane system for pressure sensitive devices. Available in various colors. Flammability certification UL 94 V-0 (6.0 mm)

Araldite® CW 5725-6 /
Aradur® HY 5726-2

Glass transition temperature (Tg):
133°C

Thermal conductivity:
0.6 W/(m.K)

Suitable for:

  • Vacuum Casting

REACH compliant, mineral filled resin with excellent impregnation capability and high crack resistance. Sedimentation free enabling IBC packaging.

Araldite® CW 30388 /
Aradur® HW 30389

Glass transition temperature (Tg): 
200°C

Thermal conductivity: 
0.95 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation. Developed for rotor potting with improved heat dissipation.

Araldite® CW 30590 /
Aradur® HW 30327

Glass transition temperature (Tg): 
170°C 

Thermal conductivity:
0.6 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Very good impregnation. Developed for rotor potting. Toughened with reinforcing fillers for superior crack and thermal shock resistance.

Araldite® CY 179 /
Aradur® 917-1 /
Accelerator DY 070

Glass transition temperature (Tg)
200°C

Thermal conductivity
0.2 W/(m.K)

Suitable for:

  • Filament winding

High strength and modulus supporting the rotor structure during operation within the entire operation range. Low CTE, outstanding dimensional stability at high loads. Low viscosity and long pot life for versatile processing, e.g. filament winding.

Arathane® CW 33664 /
Arathane® HY 33665

Glass transition temperature (Tg):
-40°C

Thermal conductivity:
1.0 W/(m.K)

Suitable for:

  • Atmospheric Casting
  • Injection

Polyurethane, flame retardant and halogen free system for processing and curing at room temperature. High flexibility and low modulus, improving battery crash-safety within the entire operation range. Adhesion to new substrates with cohesive failure mode.

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Encapsulants for Battery and Power Electronics

Encapsulants for Battery and Power Electronics

Araldite® encapsulants protect sensitive devices, improve thermal management and meet new temperature resistance requirements

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Encapsulants and Impregnation Resins for E-Motor

Encapsulants and Impregnation Resins for E-Motor

Araldite® encapsulants and impregnation resins for e-motor improve heat dissipation and extend lifetime

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Frequently Asked Questions

What are the main requirements for encapsulation resin systems?

Resin systems used for encapsulation processes must exhibit high thermal resistance and thermal conductivity, flame retardancy, excellent mechanical and dielectric properties, variable hardness and high dimensional stability.

What criteria are used to select an appropriate encapsulation technology for electronic devices?

Thermosets such as epoxies and polyurethanes are used to protect electronic devices against chemical, mechanical and electrical loads.

Extreme temperature is by far the most common stress applied to electronic devices. The ability of parts to withstand thermal shocks can be enhanced by selecting a resin with the correct coefficient of linear thermal expansion (CTE) and an optimal thermal endurance profile, in particular for high-temperature applications.

Epoxy resins are proven for long-term thermal endurance. Polyurethane systems are also available, offering thermal endurance profiles above 100° C and flexibility at low temperatures.

Chemical resistance of thermosetting resins is strongly related to the cross-linked density of the polymer network. As a rule of thumb, the harder the material, the better the chemical resistance.

How are Huntsman’s resin systems optimized for encapsulation processes?

Huntsman’s resin systems exhibit high thermal endurance for long-term reliability and high crack resistance, as we recently demonstrated in an extensive experimental study. All products are tested by our in-house electrical and mechanical testing laboratories to ensure they provide the desired properties and comply with environmental requirements. Our UL-certified laboratory can speed up the approval process and minimize time to market.

Tailored Technical Support

Simulation

Simulation exercises can quickly demonstrate the limitations or the achievable characteristics for various sets of resins and processing parameters, thus reducing the number of real-world trials that must be conducted.

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Materials Testing

By putting our products through a wide range of physical and mechanical tests, we also generate the characterization data that is required to generate accurate digital simulations.

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Processing

Your production processes need to combine superior efficiency with exceptional end-product performance. With our processing help, you’ll need fewer trials to reach optimal quality and performance for each part.

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Resin Systems for
Electronic Components

Discover our wide range of electronics applications to protect your devices against chemical, mechanical and electrical loads.

Applications for Electronics

The Right Solution for Your Manufacturing Process

Discover our electronics processes and decrease your production waste and processing time.

Processes for Electronics