Automatic Pressure Gelation

Automatic Pressure Gelation

The Automatic Pressure Gelation (APG) process is a well-established method for producing insulating parts for high-voltage applications. It is an excellent choice for large series production of components such as insulators, bushings, switch gear parts or current and voltage transformers. Huntsman produces epoxy systems specially designed to insulate and protect high-voltage components.

Optimal Chemistry for Automatic Pressure Gelation

The Automatic Pressure Gelation (APG) process features short cycle times and is well-suited to fully automated production. It delivers uniform product quality thanks to constant reactivity, constant temperature and constant viscosity of the material. Huntsman resin systems display low viscosity, sedimentation stability, fast demolding and curing, and a low coefficient of thermal expansion, which results in less stress and shrinkage.

Araldite® CW 2731

Glass transition temperature (Tg):
165°C

Thermal conductivity:
3.0 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

1-c epoxy system with deep viscosity drop above 60°C for fast processing. Very high thermal conductivity and endurance. Excellent resistance to atmospheric and chemical degradation.

Araldite® CW 30386 /
Aradur® HW 30387

Glass transition temperature (Tg):
200°C

Thermal conductivity:
0.6 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting 
  • Automatic Pressure Gelation

Developed for rotor potting. Very low CTE, highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation, high Tg. Outstanding resistance at elevated temperatures and high rotation speed.

Araldite® CW 5742 /
Aradur® HY 5726

Glass transition temperature (Tg):
210°C

Thermal conductivity:
0.7 W/(m.K) 

Suitable for: 

  • Vacuum Casting 
  • Automatic Pressure Gelation

Superior flow and gap filling capabilities enabling fast processing times. High Tg enabling low thermal expansion within the complete operation range. Very high thermal and chemical endurance (Class N).

Araldite® CW 30334 /
Aradur® HW 30335

Glass transition temperature (Tg):
100°C

Thermal conductivity:
1.2 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Well balanced properties: good heat conductivity, very good crack resistance, media and thermal resistance. Excellent flow properties allow for fast filling times and good impregnation.

Araldite® CW 30407 /
Aradur® HW 30408 /
Aradur® HW 30409

Glass transition temperature (Tg):
60 - 65°C

Thermal conductivity:
0.8 - 1.1 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Fast processing and curing comparable to impregnation processes. Excellent flow and gap filling with adaptable viscosity and thermal conductivity. High temperature and crack resistance. Recommended for hairpin windings.

Araldite® CW 30326 /
Aradur® HW 30327

Glass transition temperature (Tg):
115°C

Thermal conductivity:
0.7 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Excellent gap filling capability and heat conductivity. Toughened resin with reinforcing fillers for superior crack and thermoshock resistance. Very high thermal and chemical endurance.

Araldite® CW 1195 /
Aradur® HW 1196

Glass transition temperature (Tg):
140°C

Thermal conductivity:
0.7 W/(m.K)

Suitable for:

  • Vacuum Casting
  • Automatic Pressure Gelation

Fast fill and cure times enabling fast processing. Low coefficient of thermal expansion (28·10-6 1/K). Flammability certification UL 94 V-0 (6.0 mm) and thermal endurance (Class H).

Araldite® CW 30388 /
Aradur® HW 30389

Glass transition temperature (Tg): 
200°C

Thermal conductivity: 
0.95 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation. Developed for rotor potting with improved heat dissipation.

Araldite® CW 30590 /
Aradur® HW 30327

Glass transition temperature (Tg): 
170°C 

Thermal conductivity:
0.6 W/(m.K)

Suitable for: 

  • Vacuum Casting
  • Atmospheric Casting
  • Automatic Pressure Gelation

Very good impregnation. Developed for rotor potting. Toughened with reinforcing fillers for superior crack and thermal shock resistance.

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The Automatic Pressure Gelation (APG) process uses pressure-tight molds that are fixed in a clamping unit. Casting is typically performed under atmospheric pressure, but it can also be done under vacuum or with special gasses. During gelation, resin is continuously delivered to each mold under pressure, which eliminates voids and compensates for the shrinkage of the material. A central mixing and metering system can feed resin to several clamping machines, which can be set up for batch or continuous production.

Huntsman’s automotive products are the result of many years of leadership in the global electrical insulation sector. We have long-standing relationships with the leading manufacturers of APG equipment.

Huntsman technical support is available to guide customers through the setup phase of all processing parameters. Simulation capabilities help clients to significantly decrease development time, expediting the selection of resin systems and the determination of process parameters.

Encapsulants for Battery and Power Electronics

Encapsulants for Battery and Power Electronics

Araldite® encapsulants protect sensitive devices, improve thermal management and meet new temperature resistance requirements

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Encapsulants and Impregnation Resins for E-Motor

Encapsulants and Impregnation Resins for E-Motor

Araldite® encapsulants and impregnation resins for e-motor improve heat dissipation and extend lifetime

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Frequently Asked Questions

What are the advantages of the Automatic Pressure Gelation process?

Automatic Pressure Gelation (APG) delivers void-free castings with short cycle times. Resins can be centrally prepared and fed to the clamping machines by ring lines, increasing productivity.

What are the resin requirements for Automatic Pressure Gelation applications?

Resins for the APG process must exhibit low viscosity, sedimentation stability, fast demolding and curing, a high thermal class, high crack resistance, high heat conductivity, and a low coefficient of thermal expansion.

Resin Systems for Electronic Components

Discover our wide range of electronics applications to protect your devices against chemical, mechanical and electrical loads.

Applications for Electronics

Encapsulation Resin Systems

Our ranges of epoxy and polyurethane encapsulant chemistries meet the most stringent requirements for electronics applications in the electrified powertrain.

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Impregnation Resin Systems

Huntsman’s one- and two-component resin systems for impregnation processes insulate, protect, and improve the efficiency and durability of electric motors.

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