The Automatic Pressure Gelation (APG) process is a well-established method for producing insulating parts for high-voltage applications. It is an excellent choice for large series production of components such as insulators, bushings, switch gear parts or current and voltage transformers. Huntsman produces epoxy systems specially designed to insulate and protect high-voltage components.
The Automatic Pressure Gelation (APG) process features short cycle times and is well-suited to fully automated production. It delivers uniform product quality thanks to constant reactivity, constant temperature and constant viscosity of the material. Huntsman resin systems display low viscosity, sedimentation stability, fast demolding and curing, and a low coefficient of thermal expansion, which results in less stress and shrinkage.
Glass transition temperature (Tg):
210°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Superior flow and gap filling capabilities enabling fast processing times. High Tg enabling low thermal expansion within the complete operation range. Very high thermal and chemical endurance (Class N).
Glass transition temperature (Tg):
200°C
Thermal conductivity:
0.6 W/(m.K)
Suitable for:
Developed for rotor potting. Very low CTE, highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation, high Tg. Outstanding resistance at elevated temperatures and high rotation speed.
Glass transition temperature (Tg):
200°C
Thermal conductivity:
0.95 W/(m.K)
Suitable for:
Highest modulus and strength between -40°C and + 180°C. Very good intra-coil impregnation. Developed for rotor potting with improved heat dissipation.
Glass transition temperature (Tg):
170°C
Thermal conductivity:
0.6 W/(m.K)
Suitable for:
Very good impregnation. Developed for rotor potting. Toughened with reinforcing fillers for superior crack and thermal shock resistance.
Glass transition temperature (Tg):
165°C
Thermal conductivity:
3.0 W/(m.K)
Suitable for:
1-c epoxy system with deep viscosity drop above 60°C for fast processing. Very high thermal conductivity and endurance. Excellent resistance to atmospheric and chemical degradation.
Glass transition temperature (Tg):
140°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Fast fill and cure times enabling fast processing. Low coefficient of thermal expansion (28·10-6 1/K). Flammability certification UL 94 V-0 (6.0 mm) and thermal endurance (Class H).
Glass transition temperature (Tg):
115°C
Thermal conductivity:
0.7 W/(m.K)
Suitable for:
Excellent gap filling capability and heat conductivity. Toughened resin with reinforcing fillers for superior crack and thermoshock resistance. Very high thermal and chemical endurance.
Glass transition temperature (Tg):
100°C
Thermal conductivity:
1.2 W/(m.K)
Suitable for:
Well balanced properties: good heat conductivity, very good crack resistance, media and thermal resistance. Excellent flow properties allow for fast filling times and good impregnation.
Glass transition temperature (Tg):
85°C
Thermal conductivity:
1.0 W/(m.K)
Suitable for:
Excellent crack and thermal shock resistance with good filling factor and thermal conductivity. Superior mechanical and electrical properties. Thermal Class H, recommended for stators encapsulation.
Glass transition temperature (Tg):
60 - 65°C
Thermal conductivity:
0.8 - 1.1 W/(m.K)
Suitable for:
Fast processing and curing comparable to impregnation processes. Excellent flow and gap filling with adaptable viscosity and thermal conductivity. High temperature and crack resistance. Recommended for hairpin windings.
The Automatic Pressure Gelation (APG) process uses pressure-tight molds that are fixed in a clamping unit. Casting is typically performed under atmospheric pressure, but it can also be done under vacuum or with special gasses. During gelation, resin is continuously delivered to each mold under pressure, which eliminates voids and compensates for the shrinkage of the material. A central mixing and metering system can feed resin to several clamping machines, which can be set up for batch or continuous production.
Huntsman’s automotive products are the result of many years of leadership in the global electrical insulation sector. We have long-standing relationships with the leading manufacturers of APG equipment.
Huntsman technical support is available to guide customers through the setup phase of all processing parameters. Simulation capabilities help clients to significantly decrease development time, expediting the selection of resin systems and the determination of process parameters.
Discover our ARALDITE® encapsulants for electric motors, battery and power electronics.
Automatic Pressure Gelation (APG) delivers void-free castings with short cycle times. Resins can be centrally prepared and fed to the clamping machines by ring lines, increasing productivity.
Resins for the APG process must exhibit low viscosity, sedimentation stability, fast demolding and curing, a high thermal class, high crack resistance, high heat conductivity, and a low coefficient of thermal expansion.
